The reasons for the foaming of oxygen free copper bars at high temperatures may include the following aspects:

1. Residual gas

Gas residues during the manufacturing process: Oxygen free copper may contain trace amounts of gases such as hydrogen or oxygen during the manufacturing process. At high temperatures, these gases will expand and form bubbles.

Material pollution: If there are pollutants such as oil stains and moisture on the surface or inside of copper materials, these substances will decompose and produce gases at high temperatures, leading to foaming.

2. Oxidation reaction

Surface oxidation: At high temperatures, the copper surface is prone to react with oxygen to form copper oxide. If the oxide layer is uneven or too thick, it may cause local foaming.

Internal oxidation: If there are small pores or impurities inside the copper material, oxygen may infiltrate and cause internal oxidation at high temperatures, forming bubbles.

3. Thermal stress

Uneven thermal expansion: At high temperatures, the thermal expansion of various parts of copper material is inconsistent, which may result in stress concentration and local foaming.

Cooling too quickly: During rapid cooling, the temperature difference between the surface and interior of the copper material is too large, which may cause stress concentration and lead to foaming.

4. Impurities and defects

Impurity influence: Impurities in copper materials may react at high temperatures, producing gas or causing local melting, leading to foaming.

Internal defects, such as pores and cracks, may expand and form bubbles at high temperatures.

5. Process issues

Improper processing: During processes such as extrusion and rolling, if the process parameters are not properly controlled, it may lead to uneven stress distribution inside the copper material and easy foaming at high temperatures.

Improper heat treatment: Improper temperature or time control during the heat treatment process may cause changes in the internal structure of the copper material, leading to foaming.

6. Environmental factors

Improper atmosphere control: If the atmosphere control is poor during high-temperature treatment, such as excessive oxygen content, it may exacerbate oxidation reactions and lead to foaming.

Humidity influence: In high humidity environments, the surface of copper materials is prone to absorb moisture, and evaporation of moisture at high temperatures may cause foaming.

Solution measures

Optimize manufacturing process: reduce gas residue and impurity content.

Control heat treatment parameters: Ensure appropriate temperature and time to avoid overheating or rapid cooling.

Improve processing technology: reduce internal defects and stress concentration.

Control the environmental atmosphere: reduce oxidation reactions and gas generation.

Through these measures, the phenomenon of oxygen free copper bars bubbling at high temperatures can be effectively reduced.

Article source: Internet

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